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SPICE Modeling Engineer

The Programme 

台积公司成立于1987年,率先开创了专业集成电路制造服务之商业模式,自此成为全球规模专业集成电路制造服务公司。台积公司以领先业界的制程技术及设计解决方案组合支持其客户及伙伴生态系统的蓬勃发展,以此释放全球半导体产业的创新。身为全球的企业公民,台积公司的营运范围遍及亚洲、欧洲及北美,致力成为企业社会责任的行动者。 

Responsibilities 

  • Testkey design for SPICE modeling. 
  • SPICE model release for advanced and mainstream process. 
  • Device characterization. 
  • Customer support.
  • Automation development on all SPICE modeling flow. 

Required Skills and Abilities 

  • Minimum MS degree majoring in EE, Physics or Engineering related fields. 
  • Related experience in semiconductor device, measurement, extraction and SPICE simulation. 
  • Proficiency in programming language, such as Perl or Python or C++ or VB.Net. 
  • Must be effectively bilingual in Mandarin and English 
     
Closed 4 months ago
Closed 4 months ago
  • Job type:Graduate Jobs
  • Disciplines:

    Engineering Electrical

  • Citizenships:

  • Locations:

    Nanjing

  • Closing Date:8th May 2021, 6:00 pm

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